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Greesol G3 series
Greesol G series products are molecular-level multifunctional surfactants developed based on Gemini technology. They have low static and dynamic surface tension, good wetting and dispersing capabilities, strong foam suppression, and do not contain solvents. , Alkylphenol polyoxyethylene ether (APEO) and silicone, in the process of diamond wire cutting, the addition amount is smaller under the same effect, which effectively reduces the COD of the cutting fluid and is suitable for recycling.
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Application of Greesol G3 series products in photovoltaic silicon wafer cutting
Greesol G series products are molecular-level multifunctional surfactants developed based on Gemini technology. They have low static and dynamic surface tension, good wetting and dispersing capabilities, strong foam suppression, and do not contain solvents. , Alkylphenol polyoxyethylene ether (APEO) and silicone, in the process of diamond wire cutting, the addition amount is smaller under the same effect, which effectively reduces the COD of the cutting fluid and is suitable for recycling.
Greesol G series products can take into account both defoaming and wetting and dispersing at the same time, which solves the problems of high foaming of wetting and dispersing agents in traditional cutting fluids, and defoaming agent floating oil is not conducive to the application of cutting fluids. With the same dispersion effect of silicon powder and iron powder, the addition amount is lower, which reduces the COD value of the cutting fluid and meets the requirements of environmental protection. It is the first choice for the formulation of water-based cutting fluid.
As the traditional mortar cutting technology faces the pressure of cost, environmental protection and quality, the diamond wire cutting technology has developed rapidly in China in recent years. It has the advantages of less silicon consumption per unit production capacity, high cutting efficiency, low cost of auxiliary materials and can cut thin silicon wafers. At present, in the field of single crystal, diamond wire cutting technology has basically replaced the traditional mortar cutting process.
Compared with mortar cutting, diamond wire has the advantages of
high cutting efficiency. Diamond cutting has less leakage, which reduces the mutual wear between abrasives. Diamond has high hardness and strong wear resistance, so the cutting and service life are longer;
2. Less material loss and high film yield. Due to the strong cutting ability of diamond wire, its coating is smaller and thinner than that of (traditional) mortar, resulting in less blade loss. The damage layer caused by diamond wire cutting is smaller than that of mortar wire cutting, which is conducive to cutting thinner silicon wafers. The thinner wire diameter and thinner slices of diamond wire are beneficial to reduce material loss and increase the yield of silicon wafers.
Most diamond wire coolants use polyethylene glycol (PEG) directly. Although it has a certain effect to a certain extent, it still has many shortcomings: it is sensitive to water, and the effect of dispersing silicon powder and iron powder is not good: there are Certain environmental pollution exists; high cost.
The domestic existing diamond wire cooling liquid is mainly divided into three kinds:
one is the cooling liquid of polyethylene glycol system, such as patent CN102352278A said, it is mainly based on polyethylene glycol, adding a certain proportion of antirust agent , emulsifier and defoamer, the advantage of this cooling liquid is that it has a better cooling effect, and has a certain suspension and chelation effect on impurities such as silicon powder. The disadvantage is that it has a high cost and a certain degree of environmental pollution.
One is a mixed cooling liquid of small molecule alcohols, ethers, and phenols, such as the patent CN 102433190 A, which mainly uses propylene glycol as the main body, and is configured by adding other ethers and classified additives. This cooling liquid The advantage is that it can improve the performance of the surface of the silicon wafer, but its disadvantages are high cost, general cooling effect, and unsatisfactory dispersion of impurities such as silicon powder.
One is water-based cooling liquid, which is mainly water-based, and is made by adding dispersant, integrating agent, surfactant, defoamer, and viscosity modifier. This type of cooling liquid is mainly used in the market Mainly made in Japan, this coolant is low in cost and environmentally friendly.
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